Applications

• Metal & Metal nitride

: Ti, Ta, Co, Ru, TiN, TaN, TiAlN ……

• 100~200mm wafers

• 100nm to ≤45nm devices

Benefits

• Applications of R&D.

• Very low price

• Various additional option

Features

• ALD thin metal and metal nitride with

good thickness uniformity and 100%

conformal step coverage

• Advanced process kit and small-volume

chamber for Short cycle times

• Extremely materialize ALD Mechanism

• Direct plasma system

• Small foot print(1000X700mm)

• Totally Integrated process module

• Easy process control with Delphi software

• Minimize gas supply line length

• Load-lock system